Digital solution

Invarian solves the problem of miscorrelation with unique approach to analysis process. Different analysis engines work in concert and take interdependence of power, timing, voltage, and temperature into account. Contrary to other tools, all types of analysis are performed in continuous temperature/voltage space across the chip. InVar does not use predefined corners for analysis.

InVar starts analysis with boundary conditions for supply voltage, environment temperature, and thermal conductivity. Analysis continues through fast converging iteration steps and comes up with unique temperature/voltage numbers for every cell or part of a cell in the design. That means continuous 2D analysis space for voltage and temperature. Patentable technique increases the speed and scalability of analysis engines and gives our customers significant time advantage. User can achieve accurate analysis results with InVar fast because InVar not only runs fast, but it uses only standard input formats.

InVar reduces need for other analysis tools from multiple vendors, and our analysis results could be easily verified against “golden” tools.

Key features

  • Concurrent run of four analysis engines in fast converging analysis
  • Sophisticated scalable parallel implementation of analysis process
  • Full integration of thermal analysis with other engines
  • Real No-corner/Multi-mode ( NCMM ) timing/power/IR-drop/thermal analysis
  • Unique feedback algorithm for multiple concurrent engines
  • GUI, command line, and batch modes
  • Easy-to-use object-oriented Tcl based shell interface
  • Unique patentable approach to analysis of big macro blocks

 

 

 

Input data

  • Technology – LEF, ITF
  • Library – LEF, Liberty, GDSII
  • Hierarchycal netlist – Verilog
  • Physical design data – DEF
  • Parasitics – SPEF
  • Timing constraints – SDC
  • Switching activity – VCD, SAIF
  • Initial corner/mode setup – CPF
  • Package thermal characteristics, environmental airflow, and PCB thermal parameters (in UI)‏
  • IR-drop analysis boundary conditions - voltage source locations and parameters (in UI)
  • Electromigration constraints (in UI or input data)‏

Output data

  • Timing, power, EM, IR-drop, and thermal reports
  • Visualization of power, thermal, voltage drop, and current density ( EM ) maps
  • Export of IBIS and thermal models for IC